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Model Number : XZH-PCB
Place of Origin : China
Brand Name : Original and New
Packaging Details :
1.Inner: Vacuum packing or Anti-static package;
2.Outer: Standard export carton;
3.Customized package.
Supply Ability : 300000 Piece/Pieces per Month
Price : $0.50/pieces 1-9 pieces
Base Material : Aluminum Boards, FR-4 Glass Epoxy laminate, Aluminium base, RCC
Copper Thickness : 1-20oz
Board Thickness : 0.6-1.6MM
Min. Hole Size : 0.15MM
Min. Line Width : 0.15mm
Min. Line Spacing : 0.1MM
Surface Finishing : Immersion Silver
Product name : XZH PCB
Product Range : PCBs in 1-32Layers,HDI,Aluminum Base
Max Board Size : 610*1200MM
Surface Finish Treatment : Immersion gold,Carbon Ink,Gold Fingers,Immersion Silver;Immersion Tin
Major Laminate : King Board,ShengYi(S1141; S1170),Arlon,YGA-1-1;Rogers and others
Via Holes : 18um 135um l 70um ~ 245um18um 1 35um l 70Oum ~ 210um
Min. Via Size and Type : Dia. 0.15mm (Finished);Aspect Ratio = 12; HDI holes (<0.10mm)
100% Testing : by ICT/FCT to detect potential failures
PCB Design : schematic capture,reverse engineering
Port : Shenzhen
Description | Technology & Capabilities | | | | | ||||
1. Product Range | Rigid PCBs from 2- 24 layers, HDI; Aluminium base | | | | | ||||
2. Min. Board Thickness | 2 layer | 4 layer | 6 layer | 8 layer | 10 layer | ||||
| min. 0.2 mm | 0.4 mm | 1 mm | 1.2 mm | 1.5 mm | ||||
| 12 & 14 layer | 16 layer | 18 layer | 20 layer | 22 & 24 layer | ||||
| 1.6 mm | 1.7 mm | 1.8 mm | 2.2 mm | 2.6 mm | ||||
3. Max. Board Size | 610 x 1200 mm | | | | | ||||
4. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | | | | | ||||
5. Surface Finish Treatment | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | | | | | ||||
6. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others. | | | | | ||||
7. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | | | | | ||||
8. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | | | | | ||||
9. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (<0.10mm) | | | | | ||||
10. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | | | | | ||||
11. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI<0.10mm via | | | | | ||||
12. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | | | | | ||||
13. Solder Mask | Liquid Photo- Image (LPI) | | | | | ||||
14. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering | | | | | ||||
15. Capacity | 100 k㎡ output monthly | | | | |
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